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Problems of Semi-Mechanized Assembly of Electronic Test Equipment

โœ Scribed by Selby, C.

Book ID
119820513
Publisher
IEEE
Year
1957
Tongue
English
Weight
875 KB
Volume
2
Category
Article
ISSN
0096-1760

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Any time a structure experiences stress reversal, part of its life is used up. The two most common types of stress cycles that cause the most damage in electronic equipment are thermal/temperature cycling and vibration cycling. These two types of cycling can occur separately or they can be combined.