Printed circuit board from fibres impregnated with epoxy resin mixture, halogenated bisphenol and polyphenylene ether : Walles, E.W., Lupinski, J.H., Markovitz, M., Colborn, R.E., Presley, J.R., Davis, M.J., Minnick, M.G., Kubisen, S.J., Hallgren, J.E., Bolon, D.A., Eddy, V.J. and Irwin, P.C. (General Electric Company, Schenectady, NY, USA) US Pat 4975319 (4 December 1990)