Primary particle and agglomerate size measurement in chemical mechanical polishing (CMP) slurry using electrospray technique

✍ Scribed by Seong-Ho Yoo; Keung-Shan Woo; Benjamin Y.H. Liu

• Book ID: 117984885
• Publisher: Elsevier Science
• Year: 1998
• Tongue: English
• Weight: 113 KB
• Volume: 29
• Category: Article
• ISSN: 0021-8502
• DOI: 10.1016/s0021-8502(98)90616-4