✦ LIBER ✦
Prevention of electromigration-induced Cu pad dissolution by using a high electromigration-resistance ternary Cu–Ni–Sn layer
✍ Scribed by Y.H. Hsiao; Y.C. Chuang; C.Y. Liu
- Book ID
- 113895823
- Publisher
- Elsevier Science
- Year
- 2006
- Tongue
- English
- Weight
- 316 KB
- Volume
- 54
- Category
- Article
- ISSN
- 1359-6462
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