✦ LIBER ✦
Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow
✍ Scribed by Zhang, Z.; Guo-Quan Lu
- Book ID
- 111864597
- Publisher
- IEEE
- Year
- 2002
- Tongue
- English
- Weight
- 934 KB
- Volume
- 25
- Category
- Article
- ISSN
- 1521-334X
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