Preparation of epoxy-SiO2 hybrid sol-gel material for bone cement

✍ Scribed by Yang, Jen Ming ;Shih, Chun Hsiung ;Chang, Chen-Nen ;Lin, Feng Huei ;Jiang, Jian Ming ;Hsu, Ying Gev ;Su, Wen Yu ;See, Lai Chu

• Publisher: John Wiley and Sons
• Year: 2002
• Tongue: English
• Weight: 355 KB
• Volume: 64A
• Category: Article
• ISSN: 0021-9304
• DOI: 10.1002/jbm.a.10245

✦ Synopsis

Abstract

An organic–inorganic hybrid material, epoxy–SiO~2~, was prepared by incorporating epoxy structure units covalently into a SiO~2~ glass network via the sol–gel approach. The precursor was obtained by the reaction of diglycidyl ether of bisphenol A (DGEBA) with 3‐aminopropyl trimethoxysilane (APTS). The precursor was then hydrolyzed and co‐condensated with tetraethyl orthosilicate (TEOS) in tetrahydrofuran (THF) at room temperature to yield epoxy–SiO~2~ hybrid sol–gel material having a 50 wt % SiO~2~ content. Thermal properties of the hybrid material were characterized by differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). The hybrid sol–gel material epoxy–SiO~2~ was the solid, powder component of bone cement. The liquid component contains bis‐phenol‐A glycidyl methacrylate (Bis‐GMA), triethyleneglycol dimethacrylate (TEGDMA), and methyl methacrylate (MMA) with 25, 55, and 20 vol %, respectively. We discuss the comparison between the new epoxy–SiO~2~ bone cement and the commercial Simplex® P bone cement. Mechanical properties such as Young's modulus, compressive strength, hardness, and impact strength of the new epoxy–SiO~2~ bone cement exceeded those of Simplex^R^ P bone cement. The tensile and bending strengths of the new epoxy–SiO~2~ bone cement were approximately the same as those of Simplex® P bone cement. In order to evaluate the biocompatibility of the new bone cement, an MTT test and optical microscopy were conducted in cell culture. Results indicated that the new epoxy–SiO~2~ bone cement exhibits very low cytotoxicity compared with Simplex® P bone cement. © 2002 Wiley Periodicals, Inc. J Biomed Mater Res 64A: 138–146, 2003