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Preparation and self-assembly of copper nanoparticles via discharge of copper rod electrodes in a surfactant solution: a combination of physical and chemical processes

✍ Scribed by Su-Yuan Xie; Zhi-Jie Ma; Chun-Fang Wang; Shui-Chao Lin; Zhi-Yuan Jiang; Rong-Bin Huang; Lan-Sun Zheng


Book ID
108195154
Publisher
Elsevier Science
Year
2004
Tongue
English
Weight
416 KB
Volume
177
Category
Article
ISSN
0022-4596

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