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Preparation and Characterization of a Novel Epoxy Molding Compound with Low Storage Modulus at High Temperature and Low Glass-Transition Temperature

✍ Scribed by Hui-wang Cui, Dong-sheng Li, Qiong Fan


Book ID
118816379
Publisher
Springer US
Year
2012
Tongue
English
Weight
312 KB
Volume
41
Category
Article
ISSN
0361-5235

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