Preliminary results on Cu diffusion through grain boundaries of thin ion-plated AgSn films

✍ Scribed by A. Bukaluk; M. Rozwadowski; R. Siuda

• Book ID: 118362335
• Publisher: Elsevier Science
• Year: 1988
• Tongue: English
• Weight: 688 KB
• Volume: 200
• Category: Article
• ISSN: 0039-6028
• DOI: 10.1016/0039-6028(88)90541-9