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Prediction of the maximal recalescence temperature upon rapid solidification of bulk undercooled Cu70Ni30 alloy

✍ Scribed by W. Yang; F. Liu; H.F. Wang; Z. Chen; G.C. Yang; Y.H. Zhou


Book ID
116603482
Publisher
Elsevier Science
Year
2009
Tongue
English
Weight
579 KB
Volume
470
Category
Article
ISSN
0925-8388

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