Prediction of the excess capacitance of a via-hole through a multilayered board including the effect of connecting microstrips or striplines

✍ Scribed by Kok, P.A.; de Zutter, D.

• Book ID: 120888720
• Publisher: IEEE
• Year: 1994
• Tongue: English
• Weight: 762 KB
• Volume: 42
• Category: Article
• ISSN: 0018-9480
• DOI: 10.1109/22.339752