Prediction of the obstacle effect on fil
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L.K.H. Leung; D.C. Groeneveld; J. Zhang
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Article
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2005
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Elsevier Science
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English
โ 822 KB
A correlation has been developed to account for the effect of obstacles (simulating the spacing devices in bundles) on heat transfer in dispersed-flow film boiling. The correlation is expressed as a modification factor to the reference geometry without any obstacles. The basic form of the correlatio