Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation

✍ Scribed by Byeong-Joo Lee; Nong Moon Hwang; Hyuck Mo Lee

• Publisher: Elsevier Science
• Year: 1997
• Tongue: English
• Weight: 851 KB
• Volume: 45
• Category: Article
• ISSN: 1359-6454
• DOI: 10.1016/s1359-6454(96)00325-4