✦ LIBER ✦
Prediction of equilibrium shapes and pedestal heights to solder joints for leadless chip components : Vivek Jairazbhoy. IEEE Transactions on Components, Packaging, and Manufacturing Technology—Part A, 1996, 19(2), 224
- Book ID
- 108362267
- Publisher
- Elsevier Science
- Year
- 1997
- Tongue
- English
- Weight
- 115 KB
- Volume
- 37
- Category
- Article
- ISSN
- 0026-2714
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