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Predicting crack initiation in composite material systems due to a thermal expansion mismatch

✍ Scribed by E.S. Folias; M. Hohn


Book ID
110356896
Publisher
Springer Netherlands
Year
1998
Tongue
English
Weight
146 KB
Volume
93
Category
Article
ISSN
1573-2673

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Residual stresses develop in thermal barrier coating during cool down from processing temperature due to the thermal expansion mismatch between the dierent layers e.g., substrate, bond coat, thermally grown oxide, and TBC. These residual stresses can initiate microcracks at the bond coat/TGO/TBC int