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Precision fineness of grind measurement—techniques and instrumentation—for thick film pastes : Ronald P. Anjard, Sr.Microelectron. Reliab.23 (2), 319 (1983)


Book ID
103277547
Publisher
Elsevier Science
Year
1984
Tongue
English
Weight
126 KB
Volume
24
Category
Article
ISSN
0026-2714

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Precision fineness of grind measurement—
📂 Article 📅 1986 🏛 Elsevier Science 🌐 English ⚖ 93 KB

This capacitor is located just under the device, but not under the conductor I/O to avoid a parasitic capacitive coupling. With the coming of leadless and leaded full array chip carriers such as pin grid array, we applied the same concept with a capacitor inside the cap. The results with different c