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Potential frequency bandwidth estimation of TO packaging techniques for photodiode modules

✍ Scribed by S. J. Zhang; N. H. Zhu; Y. Liu; L. Xie

Book ID
106489052
Publisher
Springer
Year
2006
Tongue
English
Weight
171 KB
Volume
38
Category
Article
ISSN
0306-8919

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## Abstract A simple method for analyzing the effects of TO packaging network on the high‐frequency response of photodiode modules is presented. This method is established based on the relations of the scattering parameters of the packaging network, photodiode chip, and module. It is shown that the