Post-CMOS compatibly micromachined high-performance on-chip air-core solenoidal inductors
✍ Scribed by Lei Gu; Zhengzheng Wu; Xinxin Li
- Book ID
- 102517098
- Publisher
- John Wiley and Sons
- Year
- 2008
- Tongue
- English
- Weight
- 484 KB
- Volume
- 50
- Category
- Article
- ISSN
- 0895-2477
No coin nor oath required. For personal study only.
✦ Synopsis
Abstract
This article reports on‐chip micromachined solenoidal inductors with high radio‐frequency (RF) performance. The RF components can be either used in multi‐GHz telecommunication modules with a system in package scheme or monolithically integrated in RFICs with a post‐CMOS integration method. A trench SiO~2~‐refilling technique is used to shape the silicon cavity for accommodating the embedded inductor, and to mesh the substrate beneath the pads to suppress the substrate‐loss at the pads. Without de‐embedding needed, the tested inductors with 2.5–7 nH inductances achieve 33 to 13.5 peak‐Q factors at 11–3 GHz and self‐resonance frequencies of 18.0–7.5 GHz, respectively. Moreover, the inductors with the trench technique feature a high uniformity in RF‐performances, thereby, showing a promise for practical product applications. © 2008 Wiley Periodicals, Inc. Microwave Opt Technol Lett 50: 2442–2446, 2008; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.23646