Polymeric materials for electronics packaging and interconnection. ACS Symposium Series No 407. 196th National Meeting of the American Chemical Society, Los Angeles, California, September 25–30, 1988. Hg. von J. H. LUPINSKI und R. S. MOORE. ISBN 0-8412-1679-7. Washington, DC: American Chemical Society 1989. XI, 499 S., Lwd., US $ 119.95

✍ Scribed by H. von Berlepsch

• Publisher: John Wiley and Sons
• Year: 1990
• Tongue: English
• Weight: 153 KB
• Volume: 41
• Category: Article
• ISSN: 0323-7648
• DOI: 10.1002/actp.1990.010410915