In order to produce polyimide films in situ on silicon substrates, while minimizing the thermally induced residual stresses on cooling from the cure temperature, we have prepared various polyimidepolydimethylsiloxane based block copolymers derived from pyromellitic dianhydride (PMDA) and p,p'oxydian
Polyimide–polyformal block copolymers
✍ Scribed by M. M. Grade; J. W. Verbicky Jr.
- Publisher
- John Wiley and Sons
- Year
- 1989
- Tongue
- English
- Weight
- 548 KB
- Volume
- 27
- Category
- Article
- ISSN
- 0887-624X
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