Polishing of silicon by the cupric ion process : E. Mendel and K. Yang, Proc. IEEE 57, No. 9, September (1969), p. 1476

• Publisher: Elsevier Science
• Year: 1970
• Tongue: English
• Weight: 102 KB
• Volume: 9
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(70)90493-2