𝔖 Bobbio Scriptorium
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Polishing metals by a “rubbing-in” process


Book ID
104116895
Publisher
Elsevier Science
Year
1910
Tongue
English
Weight
166 KB
Volume
169
Category
Article
ISSN
0016-0032

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A hybrid model composing of 2D axisymmetric quasic-static finite element method, backpropagation network, and direct complex searching optimization for chemical mechanical polishing process (CMP) was established to investigate the optimal parameter sets under the minimum nonuniformity (NU) on wafer