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Plastic Deformation of GaSb and the Influence of Stacking-Fault Energy on Dynamical Recovery of Semiconductors

✍ Scribed by Siethoff, H. ;Brion, H. G. ;Schröter, W.

Publisher
John Wiley and Sons
Year
1991
Tongue
English
Weight
645 KB
Volume
125
Category
Article
ISSN
0031-8965

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Samples of pure Cu and a Cu-10% Zn alloy were processed by high-pressure torsion and by high-pressure torsion followed by cold-rolling to a reduction of ∼75%. The grain sizes in these two conditions were measured by transmission electron microscopy and by X-ray diffraction. The experimental results