✦ LIBER ✦
Plasma atomic layer deposited TiN metal gate for three dimensional device applications: Deposition temperature, capping metal and post annealing
✍ Scribed by Seung Chan Heo; Changhwan Choi
- Book ID
- 113797932
- Publisher
- Elsevier Science
- Year
- 2012
- Tongue
- English
- Weight
- 498 KB
- Volume
- 94
- Category
- Article
- ISSN
- 0167-9317
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