✦ LIBER ✦

Planarization of Josephson junctions for large-scale integrated Nb SFQ circuits by mechanical polishing

✍ Scribed by Tetsuro Satoh; K. Hinode; H. Akaike; Y. Kitagawa; S. Nagasawa; M. Hidaka

Publisher: Elsevier Science
Year: 2004
Tongue: English
Weight: 327 KB
Volume: 412-414
Category: Article
ISSN: 0921-4534
DOI: 10.1016/j.physc.2003.11.083

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✦ Synopsis

Mechanical polishing (MP) is a key technology for fabricating multi-layer, large-scale integrated Nb SFQ circuits. This process, however, could possibly influence junction characteristics. We studied the impact of a planarization process based on MP on the junction characteristics. The process, performed either before or after junction fabrication, did not significantly degrade the junction characteristics. We successfully demonstrated multi-layer integrated circuits with six Nb layers planarized by MP.