✦ LIBER ✦
Planarization machining of sapphire wafers with boron carbide and colloidal silica as abrasives
✍ Scribed by XiaoKai Hu; Zhitang Song; Zhongcai Pan; Weili Liu; LiangCai Wu
- Book ID
- 103819876
- Publisher
- Elsevier Science
- Year
- 2009
- Tongue
- English
- Weight
- 460 KB
- Volume
- 255
- Category
- Article
- ISSN
- 0169-4332
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