Planar process for 8-µm period bubble devices using polyimide resin

✍ Scribed by Umezaki, H.; Nishida, H.; Tsumita, N.; Koyama, N.; Nozawa, H.; Sugita, Y.

• Book ID: 114646020
• Publisher: IEEE
• Year: 1982
• Tongue: English
• Weight: 826 KB
• Volume: 18
• Category: Article
• ISSN: 0018-9464
• DOI: 10.1109/tmag.1982.1061916