Pilot production of electronic packages by powder injection moulding : R.M. German et al (Pennsylvania State University, Pennsylvania, USA)

• Book ID: 117186283
• Publisher: Elsevier Science
• Year: 1995
• Tongue: English
• Weight: 157 KB
• Volume: 50
• Category: Article
• ISSN: 0026-0657
• DOI: 10.1016/s0026-0657(99)81203-x