Physical aging of epoxy resin blended with poly(ether sulfone): Effect of poly(ether sulfone) molecular weight
β Scribed by T. Leon Yu; Y. S. Chen
- Publisher
- Springer
- Year
- 2000
- Tongue
- English
- Weight
- 778 KB
- Volume
- 7
- Category
- Article
- ISSN
- 1022-9760
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The physical aging process of 4,4 -diaminodiphenylsulfone (DDS) cured diglycidyl ether bisphenol-A (DGEBA) blended with poly(ether sulfone) (PES) was studied by differential scanning calorimetry (DSC) at four aging temperatures between T g -50ΠC and T g -10ΠC. At aging temperatures between T g -50 a
## Abstract One of the useful methods to improve the toughness of epoxy resin is by mixing the resin with poly(etherβsulfone) (PES). In the present work, two hydroxylβterminated PESs with molecular weights __M__~n~ = 28 600 and 4 200 were used for blending with epoxy resin. The curing reaction of d
## Abstract Enthalpy relaxation due to physical aging of hydroxylβterminated poly(ether sulfone)s (PES) with various molecular weights was studied by DSC at three aging temperatures between __T__~g~ β 45Β°C and __T__~g~ β 10Β°C. The experimental results revealed that both the average enthalpy relaxat
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