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Photopolymerizable liquid encapsulants for microelectronic devices: Thermal and mechanical properties of systems with reduced in-mold cure times
✍ Scribed by Kiran K. Baikerikar; Alec B. Scranton
- Publisher
- John Wiley and Sons
- Year
- 2001
- Tongue
- English
- Weight
- 261 KB
- Volume
- 81
- Category
- Article
- ISSN
- 0021-8995
- DOI
- 10.1002/app.1801
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