Seed-Mediated Growth Approach for Shape-
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N. R. Jana; L. Gearheart; C. J. Murphy
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Article
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2001
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John Wiley and Sons
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English
β 346 KB
π 2 views
## COMMUNICATIONS Fig. 3. Verification of complete exposure of Si substrate surface by CFL. The Shipley electroless Cu deposition process was used for this purpose. In the process, copper grows only on the exposed surface. Considering the poor characteristics inherent to electroless deposition, rem