Photo-MOCVD of copper thin films using Cu(II) and Cu(I) precursors for low-temperature metallization

✍ Scribed by F Maury; S Vidal; A Gleizes

• Publisher: John Wiley and Sons
• Year: 2000
• Tongue: English
• Weight: 266 KB
• Volume: 10
• Category: Article
• ISSN: 1616-301X
• DOI: 10.1002/1099-0712(200005/10)10:3/5<123::aid-amo417>3.0.co;2-7