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Phase transformation of Ni–B, Ni–P diffusion barrier deposited electrolessly on Cu interconnect

✍ Scribed by Jae Woong Choi; Gil Ho Hwang; Won Kyu Han; Sung Goon Kang

Publisher
Elsevier Science
Year
2006
Tongue
English
Weight
506 KB
Volume
253
Category
Article
ISSN
0169-4332

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