✦ LIBER ✦
Phase-field simulations of intermetallic compound growth in Cu/Sn/Cu sandwich structure under transient liquid phase bonding conditions
✍ Scribed by M.S. Park; S.L. Gibbons; R. Arróyave
- Book ID
- 119181783
- Publisher
- Elsevier Science
- Year
- 2012
- Tongue
- English
- Weight
- 892 KB
- Volume
- 60
- Category
- Article
- ISSN
- 1359-6454
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