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Percolative approach for failure time prediction of thin film interconnects under high current stress

✍ Scribed by E. Misra; Md M. Islam; Mahbub Hasan; H.C. Kim; T.L. Alford


Publisher
Elsevier Science
Year
2005
Tongue
English
Weight
133 KB
Volume
45
Category
Article
ISSN
0026-2714

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