PE-TEOS Wafer Bonding Enhancement at Low Temperature with a High-κ Dielectric Capping Layer of Al[sub 2]O[sub 3]

✍ Scribed by Chong, G. Y.; Tan, C. S.

• Book ID: 126717310
• Publisher: The Electrochemical Society
• Year: 2011
• Tongue: English
• Weight: 412 KB
• Volume: 158
• Category: Article
• ISSN: 0013-4651
• DOI: 10.1149/1.3507291