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Pb-Free solders: Part II. Application of ADAMIS database in modeling of Sn−Ag−Cu alloys with Bi additions

✍ Scribed by Ohnuma, I. (author);Ishida, K. (author);Moser, Z. (author);Ga̧sior, W. (author);Bukat, K. (author);Pstruś, J. (author);Kisiel, R. (author);Sitek, J. (author)

Book ID: 111787399
Publisher: ASM International
Year: 2006
Tongue: English
Weight: 548 KB
Volume: 27
Category: Article
ISSN: 1054-9714
DOI: 10.1361/154770306x109791

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