✦ LIBER ✦

Pb-free high temperature solders for power device packaging

✍ Scribed by Y. Yamada; Y. Takaku; Y. Yagi; Y. Nishibe; I. Ohnuma; Y. Sutou; R. Kainuma; K. Ishida

Book ID: 108210650
Publisher: Elsevier Science
Year: 2006
Tongue: English
Weight: 989 KB
Volume: 46
Category: Article
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2006.07.083

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Lead (Pb)-free solders for electronic pa

Lead (Pb)-free solders for electronic packaging

✍ Sung K. Kang; Amit K. Sarkhel 📂 Article 📅 1994 🏛 Springer US 🌐 English ⚖ 796 KB

Trends and issues in Pb-free soldering f

Trends and issues in Pb-free soldering for electronic packaging

✍ D. R. Frear 📂 Article 📅 2001 🏛 Springer 🌐 English ⚖ 975 KB

High temperature lead-free solder for mi

High temperature lead-free solder for microelectronics

✍ Frank W. Gayle; Gary Becka; Ahmer Syed; Jerry Badgett; Gordon Whitten; Tsung-Yu 📂 Article 📅 2001 🏛 The Minerals, Metals & Materials Society 🌐 English ⚖ 169 KB

High-performance power package for power

High-performance power package for power-integrated circuit devices

✍ Kasem, Y.M.; Feinstein, L.G. 📂 Article 📅 1989 🏛 IEEE 🌐 English ⚖ 907 KB

High Melting Pb-Free Solder Alloys for D

High Melting Pb-Free Solder Alloys for Die-Attach Applications

✍ M. Rettenmayr; P. Lambracht; B. Kempf; M. Graff 📂 Article 📅 2005 🏛 John Wiley and Sons 🌐 English ⚖ 335 KB

Interfacial Reaction Between Cu Substrat

Interfacial Reaction Between Cu Substrates and Zn-Al Base High-Temperature Pb-Free Solders

✍ Yoshikazu Takaku; Lazuardi Felicia; Ikuo Ohnuma; Ryosuke Kainuma; Kiyohito Ishid 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 785 KB