✦ LIBER ✦
Pattern Density Effect on the Bottom-Up Fill during Damascene Copper Electrodeposition
✍ Scribed by Akolkar, Rohan; Dubin, Valery
- Book ID
- 115439652
- Publisher
- The Electrochemical Society
- Year
- 2007
- Tongue
- English
- Weight
- 261 KB
- Volume
- 10
- Category
- Article
- ISSN
- 1099-0062
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