Partial Structure Factors and Self-Diffusion in Liquid Copper-Lead Alloys
β Scribed by S. Palchaudhuri; R. N. Joarder; R. V. Gopala Rao
- Publisher
- John Wiley and Sons
- Year
- 1984
- Tongue
- English
- Weight
- 484 KB
- Volume
- 126
- Category
- Article
- ISSN
- 0370-1972
No coin nor oath required. For personal study only.
π SIMILAR VOLUMES
The self-diffusion coefficients of copper in copper-rich Cu-Sn, Cu-In and Cu-Sb solid solutions containing up to 3 at.% Sn, 3 at.% In and 1.7 at.% Sb, respectively, in the temperature range between 1005 and 1145 K have been determined by the serial sectioning method with radioactive tracer '%u. it h
The microscopic structure and dynamics of liquid Ti x Al 1-x alloys together with pure liquid Ti and Al metals were investigated by means of molecular dynamics simulations. This work gives the structural properties, including pair-correlation function, bond-angle distribution function, HA and Vorono