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Parasitic impedance analysis of double bonding wires for high-frequency integrated circuit packaging

✍ Scribed by Sang-Ki Yun, ;Hai-Young Lee,

Book ID: 124164540
Publisher: IEEE
Year: 1995
Tongue: English
Weight: 257 KB
Volume: 5
Category: Article
ISSN: 1051-8207
DOI: 10.1109/75.410403

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