✦ LIBER ✦
Parametric study of flip-chip packaging for an MEMS device with diaphragm
✍ Scribed by Cheng-Hsin Chuang; Wen-Hui Li; Shin-Li Lee
- Publisher
- Springer-Verlag
- Year
- 2010
- Tongue
- English
- Weight
- 587 KB
- Volume
- 17
- Category
- Article
- ISSN
- 0946-7076
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