Parametric investigation of laser diode bonding using eutectic AuSn solder

✍ Scribed by J.W. Ronnie Teo; G.Y. Li; M.S. Ling; Z.F. Wang; X.Q. Shi

• Book ID: 108289460
• Publisher: Elsevier Science
• Year: 2007
• Tongue: English
• Weight: 586 KB
• Volume: 515
• Category: Article
• ISSN: 0040-6090
• DOI: 10.1016/j.tsf.2006.07.170