Palladium as a lead finish for surface mount integrated circuit packages

✍ Scribed by Abbott, D.C.; Brook, R.M.; McLelland, N.; Wiley, J.S.

• Book ID: 114560563
• Publisher: IEEE
• Year: 1991
• Tongue: English
• Weight: 568 KB
• Volume: 14
• Category: Article
• ISSN: 0148-6411
• DOI: 10.1109/33.83945