Packaging using microelectromechanical technologies and planar components

✍ Scribed by Takahashi, K.; Sangawa, U.; Fujita, S.; Matsuo, M.; Urabe, T.; Ogura, H.; Yabuki, H.

• Book ID: 118690116
• Publisher: IEEE
• Year: 2001
• Tongue: English
• Weight: 225 KB
• Volume: 49
• Category: Article
• ISSN: 0018-9480
• DOI: 10.1109/22.963143