Packaging of High Power Semiconductor Lasers

✍ Scribed by Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu (auth.)

• Publisher: Springer-Verlag New York
• Year: 2015
• Tongue: English
• Leaves: 415
• Series: Micro- and Opto-Electronic Materials, Structures, and Systems
• Edition: 1
• Category: Library

✦ Synopsis

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

✦ Table of Contents

Front Matter....Pages i-xv
Introduction of High Power Semiconductor Lasers....Pages 1-28
Overview of High Power Semiconductor Laser Packages....Pages 29-52
Thermal Design and Management in High Power Semiconductor Laser Packaging....Pages 53-88
Thermal Stress in High Power Semiconductor Lasers....Pages 89-105
Optical Design and Beam Shaping in High Power Semiconductor Lasers....Pages 107-154
Materials in High Power Semiconductor Laser Packaging....Pages 155-183
Packaging Process of High Power Semiconductor Lasers....Pages 185-226
Testing and Characterization of High Power Semiconductor Lasers....Pages 227-286
Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging....Pages 287-314
Applications of High Power Semiconductor Lasers....Pages 315-364
Development Trend and Challenges in High Power Semiconductor Laser Packaging....Pages 365-395
Back Matter....Pages 397-402

✦ Subjects

Energy Systems