✦ LIBER ✦

Packaging for microelectromechanical and nanoelectromechanical systems

✍ Scribed by Lee, Y.C.; Parviz, B.A.; Chiou, J.A.; Chen, S.

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Packaged microelectromechanical devices

📂 Article 📅 2001 🏛 Elsevier Science 🌐 English ⚖ 168 KB

Packaging of nanostructured microelectro

✍ L. H. Chen; S. Jin 📂 Article 📅 2003 🏛 Springer US 🌐 English ⚖ 136 KB

Good things, small packages [microelectr

✍ Anscombe, N. 📂 Article 📅 2004 🏛 The Institution of Electrical Engineers 🌐 English ⚖ 381 KB

Rare-earth-enabled universal solders for

✍ Sungho Jin 📂 Article 📅 2003 🏛 Springer US 🌐 English ⚖ 112 KB

Mechanical vibration of a cylindrically

✍ Izumida, W.; Hirayama, Y.; Okamoto, H.; Yamaguchi, H.; Friedland, K.-J. 📂 Article 📅 2012 🏛 The American Physical Society 🌐 English ⚖ 437 KB

Nanoelectromechanical systems

✍ Blencowe, MP 📂 Article 📅 2005 🏛 Taylor and Francis Group 🌐 English ⚖ 846 KB