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Packaging and cooling problems associated with microelectronics equipment

✍ Scribed by F. Honnor; M.A. Thomas

Book ID: 103272510
Publisher: Elsevier Science
Year: 1969
Tongue: English
Weight: 458 KB
Volume: 8
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(69)90394-1

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