✦ LIBER ✦
Optimizing the wire-bonding process for copper ball bonding, using classic experimental designs : Michael Sheaffer, Lee R. Levine and Brian Schlain. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-10, 321 (1987)
- Book ID
- 103281582
- Publisher
- Elsevier Science
- Year
- 1988
- Tongue
- English
- Weight
- 127 KB
- Volume
- 28
- Category
- Article
- ISSN
- 0026-2714
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