✦ LIBER ✦
Optimization of via hole plasma etching in polyimide for overlay interconnections
✍ Scribed by M. Deschler; P. Balk
- Publisher
- Elsevier Science
- Year
- 1986
- Tongue
- English
- Weight
- 684 KB
- Volume
- 4
- Category
- Article
- ISSN
- 0167-9317
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